4-(4-Methoxyphenyl)-1-butanol | CAS:52244-70-9
4-(4-Methoxyphenyl)-1-butanol
- Name：4-(4-Methoxyphenyl)-1-butanol
- CAS：52244-70-9
- Synonyms：4-(4-Methoxyphenyl)butan-1-ol
- Molecular Formula：C11H16O2
- Molecular Weight：180.24
- EINESC：257-782-3
Description
Properties
| Melting point | 3-4 ºC |
|---|---|
| Boiling point | 160-161 ºC (8 mmHg) |
| Flash point | >110 ºC |
| Density | 1.042 |
| Refractive index | 1.526 |
Safety
| 没有数据 | 没有数据 |
|---|
SDS
| Source | SDS/MSDS Samples |
|---|---|
| Alfa-Aesar | View & Download |
| Sigma-Aldrich | View & Download |
| Oakwood | View & Download |
Synthetic Route
| Name | CAS |
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More
Articles
Peer-Reviewed Papers
Mesogenic, trimeric, halogen-bonded complexes from alkoxystilbazoles and 1, 4-diiodotetrafluorobenzene.<BIG>Bruce DW, et al. </BIG> New. J. Chem., 32(3), 477-482 (2008)
Phosphorescent co-crystal assembled by 1, 4-diiodotetrafluorobenzene with carbazole based on C-Ip halogen bonding.<BIG>Gao HY, et al. </BIG> Journal of Materials Chemistry, 22(12), 5336-5343 (2012)
Halogen bonding as a supramolecular dynamics catalyst.Patrick M J Szell et al.Nature communications, 10(1), 916-916 (2019-02-24)
Experimental electron density study of the supramolecular aggregation between 4,4'-dipyridyl-N,N'-dioxide and 1,4-diiodotetrafluorobenzene at 90 K.Riccardo Bianchi et al.Acta crystallographica. Section B, Structural science, 60(Pt 5), 559-568 (2004-09-16)
Supramolecular Sandwiches: Halogen-Bonded Coformers Direct [2+2] Photoreactivity in Two-Component Cocrystals.Jay Quentin et al.Molecules (Basel, Switzerland), 25(4) (2020-02-23)
Strategy To Form Eutectic Molecular Liquids Based on Noncovalent Interactions.Dongkun Yu et al.The journal of physical chemistry. B, 123(23), 4958-4966 (2019-05-24)
A "σ-Hole"-Containing Volatile Solid Additive Enabling 16.5% Efficiency Organic Solar Cells.Jiehao Fu et al.iScience, 23(3), 100965-100965 (2020-03-22)
Remarks
Products protected by valid patents are not offered for sale in countries where the sale of such products constitutes a patent infringement and its liability is at buyer's risk.
Products currently covered by valid US Patents are offered for R&D use in accordance with 35 USC 271 +A13(1).
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